In a flash sale that was supposed to last ten seconds, Huawei launched its new smartphones P30 and P30 Pro in China today.
Along with the launch, different technology equipment was ruined to undo the new terminals so that they could be the first to publish disassembly reports.
EE Times He took advantage of the technical experience of System Plus Consulting (Nante, France), the associate company of Yole Développement. We asked analysts to share their initial observations and reveal the surprises they encountered.
Stéphane Elisabeth, an expert in cost analysis of System Plus Consulting, told us that the focus of its P30 Pro disassembly was directly in quad-cameras, including a 10x zoom camera. The periscope camera does not claim any loss of image quality, while the smartphone does not need to use a long barrel telescopic lens.
But as the team dissolved the P30 Pro, some surprises appeared, said Elisabeth.
First, Huawei is now using a 3-pile PCB configuration on P30 Pro. While Apple was the first smartphone provider to make PCB three-tiered in the iPhone X, Samsung followed suit, the System Plus system did not expect Huawei to recover so quickly.
It turns out that Huawei has used the SLB (Substrate Like-PCB) set of the Taiwan-based PCB provider Unimicron. The Apple PC X Apple iPhone 3 3 was mounted by AT & S headquartered in Austria.
Meanwhile P30 Pro as iPhone X use similar PCB architecture in three layers, the way they use the batteries is different.
In the P30 Pro, the lower layer incorporates the Kirin applications processor from the Huawei chip division, energy management IC and liabilities. All RF components occupy the top layer. Among them, a half-frame PCB connects the two and serves as an isolation layer, explained Elisabeth.
The main board uses three pieces of PCB manufactured and mounted by Unimicron. The first PCB has the application processor and the IC and energy management liabilities. The second is a one-sided PCB with all RF components. Between these two pieces, a PCB of half frame is used to make the connections.
Instead, Apple, in its iPhone X, has placed memory on the top layer and an application processor on the central layer. The third layer, which provided a thermal dissipation, was left blank.
The advance of stacked PCB architecture is important, explained System Plus, Elisabeth, because it allows the development of "a substrate type PCB, with very thick copper lines". The final results are "a powerful PCB without loss of power and latency, by saving space," he added.
Separating the Huawei P30 Pro, more than anything, is its use of quad cameras. The new smartphone has four cameras literally. They include a main camera, in addition to cameras for wide angle, flight time and a periscope view. The four use Sony CMOS image sensors. "It's a complete design win for Sony," said Elisabeth.
The Quad Camera module uses several different architectures. A periscope camera module is used to zoom 10x, a flight time camera module along with a flood illuminator is used to enable AR functionality and a double camera with a wide angle and a main camera.
A dual camera module uses a filter consisting of RYYB (red, yellow, yellow, blue) instead of usual RBG. While the main camera image sensor provides RGB signals, the RYYB filter helps bring more light, according to Elisabeth.
Another element to take into account with P30 Pro is the addition of a Sony Time-of-Flight camera. Although Huawei is not the first to use the Sony ToF camera (China's Oppo is already using it), Huawei uses it not only for augmented reality (AR) applications but also for "Auto Focus," Elisabeth observed.
When processing signals from all three cameras, the ToF camera helps to map a scene and allows a user to focus on a specific object. "This is the first time that a ToF camera is used for auto-focus," said Elisabeth.